Thin Film Process Filtration

Thin film deposition technology is a technique for depositing thin film materials on the surface of a substrate, which is an essential key process for the development of industries such as microelectronics, optoelectronics, and magnetic materials. Thin film deposition technology is mainly divided into two categories: physical and chemical methods, which complement each other. Physical methods are mainly used to deposit metal wires and metal compound films, while general physical methods cannot achieve the transfer of insulating materials and require chemical methods to deposit through reactions between different gases. In addition, some chemical methods can also be used to deposit metal films. Thin film deposition needs to be carried out in a vacuum environment, and ultra pure reaction gases and inert gases need to be introduced into the process chamber. In addition, the interaction and transfer of wafers between the process chamber, cooling chamber, and transfer chamber also require vacuum breaking actions, all of which need to be carried out in an extremely clean and stable environment.

1）Physical Vapor Deposition (PVD) mainly converts raw materials into a gaseous state through physical processes such as evaporation, sputtering, etc., and deposits a film on the surface of the substrate.

2）Chemical Vapor Deposition (CVD) is the process of converting vapor phase precursors into solid thin films through chemical reactions, which are deposited on the surface of a substrate.

Schematic Diagram of CVD Film Formation Principle:Common gases and their functions:

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