Chemical Mechanical Planarization(CMP) is a polishing technology used to manufacture semiconductor industrial wafers and is a technology in semiconductor device manufacturing process. It uses chemical corrosion and mechanical force to planarize silicon wafers or other substrate materials during machining. Chemical mechanical polishing solutions improve the process of creating multi-layer semiconductor circuits. Among them, the chemical polishing paste we generally called grinding liquid slurry. Due to chemical instability and processing steps, gels and agglomerates are generally formed slowly in the slurry. The large particles formed are transported to the surface of the wafer, which causes defects such as micro-scratches on the wafer surface, resulting in a significant loss of wafer yield. Therefore, it is very important for CMP filtration to remove the defects leading to large particles and agglomeration without affecting the polishing performance. Its conveying system is shown below:

CMP Slurry Conveying System:

Membrane Solutions can provide filter cartridge products specially designed for chemical mechanical polishing filtration. It can effectively remove agglomerated particles or colloids in various CMP slurry, while retaining effective abrasive particles and keeping the slurry particle size distribution unchanged.

The relevant site filters are recommended as follows:

For detailed technical solutions and product series information, please contact your MS sales engineer.