CMP Filtration
Chemical Mechanical Planarization(CMP) is a polishing technology used to manufacture semiconductor industrial wafers and is a technology in semiconductor device manufacturing process. It uses chemical corrosion and mechanical force to planarize silicon wafers or other substrate materials during machining. Chemical mechanical polishing solutions improve the process of creating multi-layer semiconductor circuits. Among them, the chemical polishing paste we generally called grinding liquid slurry. Due to chemical instability and processing steps, gels and agglomerates are generally formed slowly in the slurry. The large particles formed are transported to the surface of the wafer, which causes defects such as micro-scratches on the wafer surface, resulting in a significant loss of wafer yield. Therefore, it is very important for CMP filtration to remove the defects leading to large particles and agglomeration without affecting the polishing performance. Its conveying system is shown below:
CMP Slurry Conveying System:
Membrane Solutions can provide filter cartridge products specially designed for chemical mechanical polishing filtration. It can effectively remove agglomerated particles or colloids in various CMP slurry, while retaining effective abrasive particles and keeping the slurry particle size distribution unchanged.
The relevant site filters are recommended as follows:
| Station | Membrane Solutions Recommended Filter Cartridge Series |
| ①Coarse Filtration | MicroPure Classic Series PP Melt Blown Filter Cartridge |
| AquaPure Series String Wound Filter Cartridge | |
| ②Fine Filtration | CMPro-L Series High Flow PP Depth Cartridge Filter |
| ③Terminal Filtration | PoliCap Terminal(POU) Compact Compact Capsule Filter for CMP |
|
PoliCap-Plus Terminal(POU)Slurry Capsule Filter Capsule Filter for CMP Terminal |
For detailed technical solutions and product series information, please contact your MS sales engineer.
Products About CMP Filtration
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CMPro-P Series Polypropyene Membrane Pleated Depth Filter
CMPro-P series cartridges consist of a pleated multi-layer gradient polypropylene membrane with a polypropylene cage. Ideal for the removal of large particles and colloids from chemical mechanical polishing (CMP) fluids, this series is particularly suited to the filtration of grinding fluids used in oxide, tungsten metal and copper metal CMP processes. It effectively removes agglomerated particles and colloidal impurities from slurry. In addition, the wide, deep fold design of the CMPro-P cartridge dramatically increases the filtration area and dirt-holding capacity, resulting in ultra-low pressure loss and long service life.
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CMPro-L Series Polypropyene Membrane Winded Depth Filter
The CMPL series filter cartridges are made from multiple gradient polypropylene filter membranes that are continuously wound. Due to their multi-layer structure, they offer higher efficiency than standard melt-blown and pleated filters. The carefully designed gradient pore configuration forms a deep dirt-holding structure, providing excellent flow rates and extended service life. With a maximum precision of 0.05μm, they effectively remove both gels and particles. The multi-gradient, high dirt-holding capacity, and high-efficiency deep structure are specifically designed for slurry filtration in semiconductor CMP processes, lithium batteries, and MLCC applications.